XPG Core Reactor II 1200W PSU Review – Platinum > Gold

Part Analysis

General Data
Manufacturer (OEM) CWT (CSZ Platform)
PCB Type Double-Sided
Primary Side
Transient Filter 4x Y caps, 2x X caps, 2x CM chokes, 1x MOV
Inrush Protection NTC Thermistor SCK-207R0 (7Ohm @25°C) & Relay
Bridge Rectifier(s)
2x WB2560M

3x TF095A60 (600V, 38A) &
1x Sync Power SPN5003 (500V, 20mA @ 70°C, Rds(on): 250Ohm) (for no load consumption)

APFC Boost Diode
1x ON Semiconductor 1N13AT (650V, 16A @ 135°C)
Bulk Cap(s)

1x Nippon Chemi-Con (400V, 470uF, 2000h @ 105°C, KMW) &
1x Nichicon (400V, 820uF, 2000h @ 105°C, GL)

Main Switchers
2x Infineon 6R099P6 (650V, 24A @ 100°C, Rds(on): 0.99Ohm)
APFC Controller
Champion CM6500UNX
Resonant Controller Champion CM6901T6
Primary side: APFC, Half-Bridge & LLC converter
Secondary side: Synchronous Rectification & DC-DC converters
Secondary Side
+12V MOSFETs 10x Infineon BSC014N04LS (40V, 100A @ 100°C, Rds(on): 1.4mOhm)
5V & 3.3V DC-DC Converters: 2x Excelliance MOS EMB04N03A (30V, 55A @ 100°C, Rds(on): 4mOhm) &
2x UBIQ QN3107M6N (30V, 70A @ 100°C, Rds(on): 2.6mOhm)
PWM Controllers: uP3861P
Filtering Capacitors Electrolytic: 4x Nippon Chemi-Con (4-10,000 @ 105°C, W),
1x Nippon Chemi-Con (2-5,000 @ 105°C, KZE,
2x Rubycon (3-6,000 @ 105°C, YXG),
1x Nichicon (6,0000 @ 105°C, HV),
Polymer: 31x Caps
Supervisor IC Weltrend WT7502R (OVP, UVP, SCP, PG)
Fan Model Hong Hua HA13525H12SF-Z (135mm, 12V, 0.5A, Fluid Dynamic Bearing Fan)
5VSB Circuit
ES1DF (200V ,1A )
Standby PWM Controller OB2365

The OEM is Channel Well Technology (CWT), and the platform’s code name is CSZ. This is the same platform used in the Thermaltake GF3 1200W unit, offering good performance and ATX v3.x compliance.

The platform uses analog controllers for all circuits. We find a half-bridge topology and an LLC resonant converter on the primary side. The secondary side utilizes a synchronous rectification scheme with ten (the GF3 1200W uses eight) Infineon FETs generating the 12V rail and two VRMs for the minor rails. The cooling fan is by Hong Hua and uses a fluid dynamic bearing, so it won’t have any issues in the long run if you don’t push it hard at high temperatures above 40 degrees Celsius. Lastly, the build quality is high; the same goes for the soldering quality. At the solder side of the PCB, CWT also enhanced some PCB traces with copper plates for better conductivity and lower power losses at high loads.

XPG’s platform uses more polymer caps than Thermaltake’s implementation. Moreover, the combined capacity of the bulk caps is increased (XPG: 1290uF, Thermaltake: 1150uF), meaning that the hold-up in the XPG unit will be more prolonged.

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