Part Analysis
| General Data | |
| Manufacturer (OEM) | CWT (CSZ Platform) |
| PCB Type | Double-Sided |
| Primary Side | |
| Transient Filter | 4x Y caps, 2x X caps, 2x CM chokes, 1x MOV |
| Inrush Protection | NTC Thermistor SCK-207R0 (7Ohm @25°C) & Relay |
| Bridge Rectifier(s) |
2x WB2560M
|
| APFC MOSFETs |
3x TF095A60 (600V, 38A) & |
| APFC Boost Diode |
1x ON Semiconductor 1N13AT (650V, 16A @ 135°C)
|
| Bulk Cap(s) | |
| Main Switchers |
2x Infineon 6R099P6 (650V, 24A @ 100°C, Rds(on): 0.99Ohm)
|
| APFC Controller |
Champion CM6500UNX
|
| Resonant Controller | Champion CM6901T6 |
| Topology |
Primary side: APFC, Half-Bridge & LLC converter
Secondary side: Synchronous Rectification & DC-DC converters |
| Secondary Side | |
| +12V MOSFETs | 10x Infineon BSC014N04LS (40V, 100A @ 100°C, Rds(on): 1.4mOhm) |
| 5V & 3.3V | DC-DC Converters: 2x Excelliance MOS EMB04N03A (30V, 55A @ 100°C, Rds(on): 4mOhm) & 2x UBIQ QN3107M6N (30V, 70A @ 100°C, Rds(on): 2.6mOhm) PWM Controllers: uP3861P |
| Filtering Capacitors | Electrolytic: 4x Nippon Chemi-Con (4-10,000 @ 105°C, W), 1x Nippon Chemi-Con (2-5,000 @ 105°C, KZE, 2x Rubycon (3-6,000 @ 105°C, YXG), 1x Nichicon (6,0000 @ 105°C, HV), Polymer: 31x Caps |
| Supervisor IC | Weltrend WT7502R (OVP, UVP, SCP, PG) |
| Fan Model | Hong Hua HA13525H12SF-Z (135mm, 12V, 0.5A, Fluid Dynamic Bearing Fan) |
| 5VSB Circuit | |
| Rectifier |
ES1DF (200V ,1A )
|
| Standby PWM Controller | OB2365 |
The OEM is Channel Well Technology (CWT), and the platform’s code name is CSZ. This is the same platform used in the Thermaltake GF3 1200W unit, offering good performance and ATX v3.x compliance.
The platform uses analog controllers for all circuits. We find a half-bridge topology and an LLC resonant converter on the primary side. The secondary side utilizes a synchronous rectification scheme with ten (the GF3 1200W uses eight) Infineon FETs generating the 12V rail and two VRMs for the minor rails. The cooling fan is by Hong Hua and uses a fluid dynamic bearing, so it won’t have any issues in the long run if you don’t push it hard at high temperatures above 40 degrees Celsius. Lastly, the build quality is high; the same goes for the soldering quality. At the solder side of the PCB, CWT also enhanced some PCB traces with copper plates for better conductivity and lower power losses at high loads.
XPG’s platform uses more polymer caps than Thermaltake’s implementation. Moreover, the combined capacity of the bulk caps is increased (XPG: 1290uF, Thermaltake: 1150uF), meaning that the hold-up in the XPG unit will be more prolonged.
