ΗΥΤΕ Υ40 Case Review: Thermal & Noise Damping/Output Evaluation

Test System

Test System Specs
Mainboard Gigabyte X670E AORUS Master
Bios Version F10a
CPU Ryzen 9 7950X3D
GPU Galax GeForce RTX 4060 EX
NVMe XPG GAMMIX S50 Lite 1TB
RAM XPG Lancer DDR5 (2 x 16GB) 6000MHz
Power Supply EVGA SuperNOVA 1000 G7
CPU Cooler NH-D15S chromax.black
Case What is under test!
Ambient Temperature 25°C ±0.1°C
Drivers AMD Chipset: 5.11.02.217
AMD Adrenalin: 24.2.1
NVIDIA: 551.76

I used a modded Gigabyte X670E AORUS Master as the testing mainboard, with three thermal probes (K-Type) installed on its VRMs, chipset, and NVMe drive. Although I use a climate chamber, I also monitor the ambient temperature and have another thermal probe at the PSU’s exhaust and one at the chassis’ exhaust. I obtain the rest of the system temperatures, CPU, and GPU through the custom-made software I use for conducting all thermal measurements.

Please note that I use a different system for shooting photos, the assembly page, and those mentioned above for thermal testing.

I use a Powenetics v2 kit to monitor power consumption and every other important aspect of the system.

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