Part Analysis
| General Data | |
| Manufacturer (OEM) | CE-Link |
| PCB Type | Single-Sided |
| Primary Side | |
| Transient Filter | 4x Y caps, 2x X caps, 2x CM chokes, 1x MOV |
| Inrush Protection | 1x NTC Thermistor MF72-5D15 (5 Ohm @ 25°C) & Relay |
| Bridge Rectifier(s) |
2x HS GBU15V08 (800V, 15A @ 40°C)
|
| APFC MOSFETs |
2x Lonten LSD55R140GT (550V, 15A @ 100°C, Rds(on): 0.14Ohm)
& Champion CM03X (for no load consumption) |
| APFC Boost Diode |
1x Global Power G4S0658AT (650V, 8A @ 153°C)
|
| Bulk Cap(s) |
1x Nichicon (400V, 820uF, 2,000h @ 105°C, GL(M))
|
| Main Switchers |
2x Lonten LSD65R099GF (650V, 26A @ 100°C, Rds(on): 0.099Ohm)
|
| Resonant Controller |
Champion CU6901T6X
|
| APFC Controller |
Champion 6500UNX
|
| Topology |
Primary side: APFC, Half-Bridge & LLC converter
Secondary side: Synchronous Rectification & DC-DC converters |
| Secondary Side | |
| +12V MOSFETs | 6x Lonten LSGN04R013WE (40V, 101A @ 100°C, Rds(on): 1.35mOhm) |
| 5V & 3.3V | DC-DC Converters: 4x Vergiga Semiconductor VS3610GPMT (30V, 49A @ 100°C, Rds(on): 3.3mOhm) PWM Controller(s): 2x Anpec APW7164 |
| Filtering Capacitors | Electrolytic: 1x Nichicon (9-10,000h @ 105°C, HW(M)) 9x Teapo (3,000h @ 105°C, SC) 6x Teapo (2-6,000h @ 105°C, SY) Polymer: 18x Teapo |
| Supervisor IC | GRENERGY GR8329E (OVP, UVP, OCP, ) |
| Fan Model | TT-1225 GQR1225D12M (120mm, 12V, 0.20A, Fluid Dynamic Bearing Fan) |
| 5VSB | |
| Rectifier |
1x Jiangsu SP1060L SBR (60V, 10A)
|
| Standby PWM Controller | Esthome EST.2915HP |
While the HKC version uses a higher-quality double-sided PCB, this one uses a plain single-sided PCB, usually found in low-cost PSUs. The FETs are also of lower quality. The CE-Link version uses a single bulk cap, while the HKC version uses two Rubycon ones, with lower combined capacity but of notably higher quality. The APFC and resonant controllers are the same, and the same applies to the controllers that handle the minor rails.
The primary topology and the design on the secondary side are also the same. The CE-Link version uses more electrolytic caps of decent quality and has three fewer polymer caps than the HKC version. Moreover, the supervisor IC is different.
A major difference is the cooling fan, which uses a true fluid dynamic bearing in the CE-Link version, while a plain sleeve/rifle bearing is used in the HKC version. Lastly, there are also differences in the 5VSB circuit, as expected.
 |
 |
| CE-Link Made Unit | HKC Made Unit |
The CE-Link unit has a lower-quality PCB, which matters a lot in terms of performance, and its FETs are from a less-known manufacturer. The filtering caps on the secondary side are slightly higher quality, while its fan is notably better than the one used in the HKC model. Overall, the HKC unit’s design is superior, allowing for better airflow, especially on the secondary side.
—“… a brand changes OEMs without changing the product’s name or providing some information on the box to help buyers distinguish the different versions.”
Aris, is there at least some info on the outside of the unit when it’s not on the box?
If not, that’s pretty rude 😈
only the “Made in Vietnam” can help an educated user spot this unit from the HKC one.
thanks for the clarification 😉
Totally blasted the Thermaltake Toughpower GF A3 750W ATX v3.1, but that’s fair enough.
Failure to style by TT.