Part Analysis
| General Data | |
| Manufacturer (OEM) | High Power |
| PCB Type | Double-Sided |
| Primary Side | |
| Transient Filter | 4x Y caps, 2x X caps, 2x CM chokes, 1x MOV, 1x MPS HF81 (X Capacitor Bleeder) |
| Inrush Protection | NTC Thermistor SCK-057 (5 Ohm @ 25°C) & Relay |
| Bridge Rectifier |
2x HY GBU1006F (600V, 10A @ 100°C)
|
| APFC MOSFETs |
2x Sanrise Tech SRC60R108BS (650V, 14A @ 125°C, Rds(on): 108mOhm)
|
| APFC Boost Diode |
Macrocore Semiconductor HX1D08065A
|
| Bulk Cap(s) |
Teapo (420V, 680uF, 2000h @ 105°C, LS)
|
| Main Switchers |
2x Wuhan Xinyuan CWS60R099B (600V, 25A @ 100°C, Rds(on): 0.099Ohm)
|
|
APFC Controller |
Infineon ICE3PCSO1G |
| Resonant Controller |
Champion CU6901VAC
|
| Topology | Primary side: APFC, Half-Bridge & LLC Resonant Converter Secondary side: [12V] Synchronous Rectification & [Minor Rails] DC-DC converters |
| Secondary Side | |
| +12V MOSFETs | 6x Toshiba TPHR8504PL (40V, 340A @ 100°C, Rds(on): 0.85mOhm) |
| 5V & 3.3V | DC-DC Converters: 4x Vishay SiRA12BDP (30V, 59A @ 100°C, Rds(on): 0.0043Ohm) PWM Controller(s): UPI-Semi uP3861P |
| Filtering Capacitors | Electrolytic: 9x Teapo (1-3,000 @ 105°C, SC) Teapo (1,000 @ 105°C, SEK) Polymer: 22x Teapo |
| Supervisor IC | Weltrend WT7527RA (OVP, UVP, OCP, PG) |
| Fan Model | Globe Fan RL4Z S1352512H (135mm, 12V, 0.33A, Fluid Dynamic Bearing Fan) |
| 5VSB Circuit | |
| Synchronous Rectifier IC |
Shenzhen LP3510
|
| Standby PWM Controller |
Si-Trend SI8016HSP8
|
The OEM is High Power, and the platform uses a contemporary design. I want the modular board to be directly connected to the main PCB through bus bars, rather than through power cables, which are longer and thus increase energy losses, especially under high loads. The primary heatsink is relatively small, a typical feature of today’s efficient power supplies. Moreover, there are no proper heatsinks on the secondary side. All in all, given the product’s price, the quality of the parts used is satisfactory, and the same can be said for its build quality.
The transient filtering stage contains all the necessary components to block both incoming and outgoing EMI emissions. Typically, it starts at the AC receptacle and continues on the main PCB. It includes an X Capacitor Bleeder IC, which provides a slight efficiency boost.
There is an MOV to protect from voltage surges and an NTC thermistor with a resistance of 5 ohms. Moreover, a bypass relay supports the NTC thermistor.
The two HY GBU1006F parallel bridge rectifiers can handle up to 20A together.
The APFC converter uses two Sanrise Tech SRC60R108BS FETs and one Macrocore Semiconductor HX1D08065A boost diode. Teapo manufactures the bulk capacitor. Their combined capacity is 680 μF, and it is rated for 2,000 hours at 105 °C. Their voltage rating is sufficient at 420V, which is not so close to the APFC’s DC bus voltage (approximately 380-400V DC).
The APFC controller is an Infineon ICE3PCSO1G.
The two Wuhan Xinyuan CWS60R099B primary switching FETs are installed in a half-bridge topology, and an LLC resonant converter is utilized for enhanced efficiency.
The LLC resonant controller is a Champion CU6901VAC.
The PSU’s main transformer. One of its main functions is to electrically isolate the primary and secondary sides.
Six Toshiba TPHR8504PL FETs regulate the 12V rail. They are installed on the business (top) side of the main PCB.
Two DC-DC converters generate the minor rails. They use four Vishay SiRA12BDP FETs. The PWM controller is a UPI-Semi uP3861P.
Teapo provides all capacitors, both electrolytic and polymer ones.
You can find more information about capacitor performance and other specs below:
The standby PWM controller is a Si-Trend SI8016HSP8, and the secondary side rectifier is a Shenzhen LP3510.
Several polymer caps at the face of the modular panel form an extra ripple-filtering layer.
The soldering quality is satisfactory.
The cooling fan is a Globe Fan RL4Z S1352512H, utilizing a fluid dynamic bearing.
