World’s First Full-Band High-Speed Communication Chip Debuts in China

Chinese researchers have unveiled the world’s first adaptive, full-band, high-speed communication chip, a breakthrough that could power 6G networks, next-generation radar, and autonomous vehicles.

Developed by a team from Peking University in collaboration with the City University of Hong Kong, the chip is based on thin-film lithium niobate (TFLN), an advanced photonic material known for its high bandwidth and efficiency. Unlike traditional chips limited to specific frequency bands, this device integrates optoelectronic fusion technology, enabling seamless conversion between optical and wireless signals across the entire spectrum.

Breaking The Frequency Barrier

Traditional hardware design has long struggled with the so-called “frequency gap,” where devices can only operate within narrow bands. The new chip changes that by supporting flexible, real-time signal routing across a broad range of frequencies, from 0.5 GHz to 115 GHz, covering nearly eight octaves.

Key features include:

  • Broadband optical & wireless conversion for ultra-fast data transfer.
  • Low-noise carrier oscillator technology that ensures stability at high frequencies.
  • Digital baseband modulation for efficient processing.
  • Consistent performance across all bands, even in the notoriously noisy terahertz range.

The result: transmission speeds of over 120 Gigabits per second, surpassing the 6G peak rate requirements.

Why It Means

  • 6G Networks – Unlocks terahertz and higher bands for ultra-fast, low-latency communications.
  • Radar Technology – Enhances high-frequency signal processing, which is crucial for defense and aerospace applications.
  • Autonomous Driving – Supports high-resolution imaging and sensing for safer navigation.
  • Precision Sensing – Potential breakthroughs in medical imaging and industrial automation.

Beyond Communications

The researchers also designed an integrated optoelectronic oscillator (OEO) architecture using optical micro-ring resonators, which avoids noise buildup found in traditional frequency multipliers. This enables the dynamic reconfiguration of frequencies while maintaining low noise—a key step for AI-native networks that can adapt in real-time to complex environments.

According to Professor Wang Xingjun, the chip lays the groundwork for future base stations and vehicular devices capable of sensing their environment while transmitting data, signaling a “comprehensive transformation across the entire chain, from materials to networks.”

The Bottom Line

With 6G expected to rely heavily on terahertz bands, this breakthrough, led by China, represents a milestone in communications technology. It bridges the frequency gap, scales to unprecedented speeds, and opens new frontiers in sensing and AI-driven connectivity.

Published in Nature, the work marks not just an incremental step, but a fundamental leap toward the networks of the future.

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