First Truly 3D Chip Made in U.S.

A team of U.S. researchers has built the first monolithic 3D computer chip manufactured in a commercial American foundry, a breakthrough that could significantly boost AI performance while cutting energy use.

The experimental chip was developed by engineers from Stanford University, MIT, Carnegie Mellon, and the University of Pennsylvania, and produced at SkyWater Technology, the largest pure-play U.S. semiconductor foundry.

Why This Chip Matters

Today’s chips are mostly flat. Memory and computing units sit side by side, forcing data to travel long distances inside the chip. This creates a major slowdown known as the “memory wall,” especially for AI systems that constantly move massive amounts of data.

The new chip solves this by stacking memory and computing layers vertically, like floors in a skyscraper. Shorter data paths mean faster processing and better efficiency.

Big Performance Gains

In early hardware tests, the 3D chip delivered around four times higher performance than a similar flat chip. Computer simulations of taller versions showed up to 12× speedups on AI workloads, including models based on Meta’s LLaMA architecture.

Researchers believe future versions could eventually achieve 100× to 1,000× improvements in energy efficiency and speed combined, a key requirement for next-generation AI.

Built In A Real U.S. Factory

Unlike earlier 3D chip experiments limited to university labs, this chip was made on SkyWater’s production line using established manufacturing processes. It combines traditional silicon logic with carbon nanotube transistors and advanced memory, all built layer by layer without damaging the circuits underneath.

“This shows that advanced 3D chips aren’t just a lab idea, they can be made domestically, at scale,” said SkyWater’s Mark Nelson.

A Glimpse Of The Future

The research was presented at IEDM 2025, one of the world’s leading semiconductor conferences. Beyond raw performance, the work highlights a possible path for the U.S. to regain leadership in advanced chip manufacturing.

As AI models grow larger and more demanding, stacking chips upward, instead of shrinking them sideways, may be the key to keeping progress alive.

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