A Shenzhen-based unit of Chinese semiconductor equipment maker SiCarrier has rolled out two new chip design software tools, marking another major step in the country’s
Tag: components
Researchers at EPFL (École Polytechnique Fédérale de Lausanne) have developed a novel 3D printing technique that “grows” metal and ceramic structures within hydrogel scaffolds, yielding
HYTE, a manufacturer of advanced PC components and peripherals, has introduced the X50 and X50 Air, two new mid-tower PC cases designed to offer a
A new network-on-chip (NoC) IP promises to significantly accelerate chip development by using AI to automate key processes and minimize wire length. This leads to
Murata at CES 2025, unveiled what is claimed to be the world’s smallest chip inductor, measuring just 006003 inches (0.16×0.08 mm). This groundbreaking development achieves
In industries where sensitive electronic components and high-stakes equipment are standard, electrostatic discharge (ESD) poses a severe risk. ESD incidents, often triggered by contact with